TAIPEI, Jan. 9, 2025 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, unveils the new generation of Intel® B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel® Core™ Ultra and AMD Ryzen™ processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.
GIGABYTE Redefines Intel and AMD B800 Series Motherboards Performance with AI Technology at CES 2025
GIGABYTE B860 and B850 motherboards feature all digital power design and premium thermal solution with a unique heatsink that improves the cooling surface up to 4 times, combined with heat pipes, and high thermal conductivity pads for superior cooling efficiency. Focusing on user-friendly features for an easy PC build experience, GIGABYTE includes complete DIY-friendly innovations from PCIe EZ-Latch Plus, and M.2 EZ-Latch Click to WIFI EZ-PLUG onboard for a hassle-free installation.
Alongside high-end AORUS PRO and ELITE, GIGABYTE GAMING(X), and EAGLE models, GIGABYTE offers the ICE series featuring a comprehensive white aesthetic with pure white PCB, memory DIMM slots, PCIe slots, connectors, and a debug port delivering a complete solution for white build enthusiasts. Not only catering to gamers' needs, the GIGABYTE B850 AI TOP is also compatible with GIGABYTE's AI TOP utility for local AI fine-tuning. Visit GIGABYTE EVENT | CES 2025 for more info on GIGABYTE B800 series motherboards.