SK hynix Begins Volume Production of the World's First 12-Layer HBM3E

• The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by the end of the year
• DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product
• The company to continue HBM's success with outstanding product performance and competitiveness

SEOUL, South Korea, Sept. 26, 2024 /PRNewswire/ -- SK hynix Inc. (or 'the company', www.skhynix.com) announced today that it has begun mass production of the world's first 12-layer HBM3E product with 36GB^[1], the largest capacity of existing HBM^[2] to date.