At the event, Axcelis will host a company exhibit and the company's technologists and collaborators will present on nine topics:
- Performance of an Aluminum Sputtering Source for High Current Doping in Power Devices
- Energetic and Surface Metals Characterization of Purion XEmax With and Without Boost™ Technology Using Vapor Phase Decomposition-Inductively Coupled Plasma Mass Spectrometry
- Radiation Characterization and Mitigation of High Energy H+ Beams
- Wear-Resistant Surface Coatings for Long Electrostatic Chuck Life and Stable Performance
- Self-contained Predictive System Diagnostic Sensors
- Comparison of Arsenic and Antimony Dopant Distribution Profiles of Very High Energy Implantations
- New Challenges and Opportunities in Wide Bandgap Materials with Ion Implantation and Annealing Co-Optimization
- Dual Cathode Ion Source for Axcelis' High Energy Implanters
- Low Metals Ion Source
For more information on the event, or to register, visit the conference website at https://smartconf.jp/content/iit2024.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 45 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
CONTACTS:
Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
Press/Media Relations Contacts:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
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